Abstract: This paper presents a methodology to help prevent overdesign of Electrostatic Discharge (ESD) protection circuits for internal I/O in 2.5D/3D bonding technologies. We explore how the voltage ...
Abstract: Advanced integrated circuit (IC) systems increasingly utilize chiplet-based packaging with complex $2.5 \mathrm{D} / 3 \mathrm{D}$ structures and dense Through-Silicon Via (TSV) arrays.
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