Abstract: Ensure that the mechanical structure of the designed Bigen fruit shell and kernel separator can meet its mechanical characteristics, the structure of the Bigen fruit shell and kernel ...
Abstract: Advanced integrated circuit (IC) systems increasingly utilize chiplet-based packaging with complex $2.5 \mathrm{D} / 3 \mathrm{D}$ structures and dense Through-Silicon Via (TSV) arrays.
Evaluating and iterating upon recommender systems is crucial, yet traditional A/B testing is resource-intensive, and offline methods struggle with dynamic user-platform interactions. While agent-based ...
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