Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

The complexity problem The most direct explanation for why materials misbehave in production is also the most uncomfortable ...

> Sanofi-aventis has implemented Lanner's process simulation software at a U.K. facility, following a pilot implementation that yielded $1.65 million in inventory cost savings in six months. Release ...

As non-face-to-face consumption becomes routine, packaging material usage has surged. Starting from the 30th, regulations on excessive packaging for deliveries will take effect. This has increased ...