However, sTIMs cannot be used alone, they require backside metallization (BSM) on the module to establish a thermal path and ...
Abstract: Advances in the high performance computing (HPC) lead to a new frontier of the fan out wafer level packaging (FOWLP) development. To provide a solution of cost-attractive package for ...
Abstract: Based on the requirements of high-end automotive IC packaging, multiple active and/or passive sub-components interconnected to create a single complex circuit within a single Multi-Chip ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results