The Global Memory Wafer Market was valued at USD 58470 Million in the year 2024 and is projected to reach a revised size of ...

Sarcina Technology, a specialist in semiconductor and photonic packaging, has won the “Packaging: Hardware” category at the 2026 Chiplet Summit Best of Show Awards for its advanced AI package design ...

The startup is trying to transform its Claude AI model from a coding tool into a much broader workplace technology platform.

Combine scalable analytics with advanced AI capabilities like LLMs and agentic tasks to create a new chipmaking platform.

The move to multi-die integration brings both promise and complexity. Scalable interconnects and automation are emerging as ...

The technology provider has worked with two German companies to equip their light packaging sorting facility in Breman, ...

Accelerating strategic pivot to Navitas 2.0 with focus on GaN and high-voltage SiC solutions targeting high growth, high-power markets (AI Data ...