Electronic Design

Integrated Voltage Regulators Help Pull Heat Out of Processors

At APEC, Empower Semiconductor showed how its Crescendo vertical power delivery solution can help improve thermal management ...
IEEE

Less Is More: Non-TIM Air-Cooled Ceramic Packaging for SiC Power Modules to Extend Thermal Performance and Mechanical Reliability Boundaries

Abstract: Power module packaging remains one of the constraints preventing silicon carbide (SiC) devices from realizing high power density and optimal reliability in converters. This article proposes ...

JEDEC LPDDR6 Roadmap Signals Major Shift to Memory-Centric Computing

JEDEC is nearing the completion of an LPDDR6 Processing-in-Memory (PIM) standard. Essentially, by baking processing capabilities directly into the memory itself, this tech reduces the need to ...
Yahoo Style Australia

Product recall roundup: Bread from Coles, IGA chocolate, power bank sold at Optus, Telstra, JB Hi-Fi, and pantry staple

Add Yahoo as a preferred source to see more of our stories on Google. Aussies have been warned about numerous items that have been recalled this week. Source: Getty There have been multiple items ...
Hackaday

This KiCAD Plugin Enables Breadboarding

Some people learning the noble art of electronics find the jump from simpler tools like Fritzing to more complex ones, such as KiCAD, a little daunting, especially since they need to learn at least ...
IEEE

Advanced Spatial Temperature Monitoring of Power Modules via Fourier Neural Operator-Based Thermal Model

Abstract: Accurate monitoring of power module spatial temperature (PMST) remains a critical challenge in power electronics. This letter proposes a Fourier neural operator-based thermal model (FNO-TM) ...