Circuit Technology Training Inc. (CTTI), a US-based provider of technical instruction for the electronics manufacturing industry, has launched a new course on X-ray inspection technology, aiming to ...
Abstract: The increasing demand for computing power has driven advancements in chip packaging towards larger sizes and higher power densities. FCBGA (flip-chip ball grid array) technology, which ...
Abstract: This study used mechanical properties to compare whether pure indium and indium-silver alloys with different silver contents as thermal interface materials (TIM) for flip-chip ball grid ...