Siemens Launches Fuse EDA AI Agent for Autonomous Workflow Orchestration in Semiconductor, 3D IC, and PCB Design ...

AGNIT Semiconductors Raises $2.6 Million Seed Extension, Targets 1 Lakh GaN Components and Commercial Shipments from July 2027 ...

SASTRA University has formalized separate partnerships with Tata Electronics and Caliber Interconnects through the signing of Memorandums of Understanding (MoUs). As part of these collaborations, ...

Bourns, introduced four new multilayer chip inductor series: CE0603G, CE0603M, CE1005Q, and CE1608Q. The inductors feature a monolithic structure created through advanced multilayer technology. They ...

Kyocera has announced it has completed the acquisition of all shares in NEC Toppan Circuit Solutions and the company has become a wholly-owned subsidiary. The new company name is KYOCERA Circuit ...

The new XJFlash from XJTAG allows you to automatically generate customized programming solution for the flash devices connected to FPGAs on your board. XJFlash automatically generate a custom design ...

Intel started volume production of finFET based 14nm semiconductor wafers. Intel's 14nm Core M processor architecture powered gadgets are going to hit the market during the Christmas and year-end ...

The new version of the Standard Co-Emulation Modeling Interface (SCE-MI) 2.3 from Accellera expands the set of SCE-MI compliant DPI function argument data types helping VLSI chip design engineers with ...

ROHM and Infineon Technologies AG have signed a Memorandum of Understanding to collaborate on silicon carbide (SiC) power semiconductor packages for applications including on-board chargers, ...

Analog integrated circuits form the backbone of countless electronic systems, serving as the essential interface between the physical world and digital processing systems. From precision sensors that ...