A team led by academician Huang Ru and Professor Wu Yanqing from the School of Integrated Circuits at Peking University has ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
Nippon Electric Glass Co. has embarked on developing an innovative glass core substrate compatible with CO2 laser processing, aiming to enhance the efficiency of manufacturing next-generation ...
BOSTON, MA, UNITED STATES, February 18, 2025 /EINPresswire.com/ -- UniversityWafer, Inc., a global leader in advanced semiconductor substrates, is proud to announce ...
TOKYO--(BUSINESS WIRE)--Shin-Etsu Chemical Co., Ltd. (TOKYO: 4063) (Head Office: Tokyo; President: Yasuhiko Saitoh; hereinafter, “Shin-Etsu Chemical”) has developed equipment to manufacture ...
Why it matters: Many believe that glass substrate technology will enable the industry to sustain Moore's Law beyond 2030, ensuring continuous development without being constrained by process size ...
South Korea's LG Chem has introduced a liquid photo-imageable dielectric to enhance semiconductor packaging, targeting AI and high-performance sectors. This new material improves circuit precision and ...
Increasing silicon carbide (SiC) substrate supply from China at lower prices is expected to fuel Taiwan-based foundry houses' diversification into compound semiconductors. Save my User ID and Password ...
TL;DR: Samsung Electronics is prioritizing advanced semiconductor packaging and robotics as key growth engines, focusing on next-gen glass interposers to enhance AI chip performance by 2028. The ...
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