Demands for rich, diverse, and instantaneous networked multimedia experiences from mobile consumer devices such as smart phones, tablets, and ultrabooks continue to re-sculpt the industry’s landscape.

A technical paper titled “Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective” was published by researchers at Virginia Polytechnic Institute and ...

SiC and GaN device makers are using advanced junction structures and innovative packaging to offer more robust, cooler-running products. Advanced packaging technologies are also fueling the rise of ...

SUNNYVALE, Calif.--(BUSINESS WIRE)--Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap ...

Higher education IT leaders understand the benefits of a device management program but getting it to run smoothly can be easier said than done. With the current state of the supply chain, being ...

As the adoption of Internet of Things (IoT) devices increase, the ability to implement sensors in challenging and remote environments has been limited due to the device’s power management requirements ...

WILMINGTON, Mass.--(BUSINESS WIRE)--Analog Devices, Inc. (Nasdaq: ADI) today announced the world’s first Single-pair Power over Ethernet (SPoE) Power Sourcing Equipment (PSE) and Power Device (PD) ...