PITTSBURGH, Sept. 29, 2014 /PRNewswire/ -- ANSYS announced today that its RedHawk(TM) and Totem(TM) products are certified for TSMC 16-nanometer (nm) FinFET+ (N16FF+), a second-generation FinFET ...
Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
" Ansys' suite of multiphysics simulation tools instill confidence in our customers, ensuring their semiconductor systems achieve the highest levels of thermal, signal, power, and mechanical integrity ...
FinFET technology is a three-dimensional transistor architecture that results in higher-performing and lower power chips used in mobile, computing and networking applications. Designs implemented ...
(NASDAQ: ) has collaborated with TSMC to certify that Ansys RedHawk-SC™ and Ansys® Redhawk-SC Electrothermal™ are compliant with TSMC's 3Dblox™ standard for the exchange of design data between ...
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